Dynatex International is a world leader in wafer/diode die separation products for semiconductor and related industries, providing fabless services, equipment and materials.
GST Scriber/Breaker
The GST equipment is automated using a Windows™ NT interface, ensuring consistency and speed. Once the test wafer or laser bar is calibrated, production wafers move quickly through the process with little production support. Within seconds of proper alignment, the GST processes the wafer or laser bar and is ready for more in a 24/7 production environment.
How Dry Process Dicing™ Works
Using a gem quality diamond scribe tool, the GST equipment scribes a precision 3-5 micron scribe line along the narrow streets between die on the surface of the wafer or laser bar. From the bottom of the wafer, the breaking mechanism delivers an exact impact to the scribe line, held in place during impact either by an anvil on the surface of the wafer or with vacuum from the bottom side. The wafer breaks along the scribe line, cleanly separating the die.
GST Benefits
Zero kerf loss allows higher die density on the wafer
- Zero kerf loss allows higher die density on the wafer
Superior yield and improved efficiency
- Superior yield and improved efficiency
Increased production rates
- Increased production rates
Chip free results
- Chip free results
Less residual stress
- Less residual stress
No toxic water discharge
- No toxic water discharge
No D.I. water costs
- No D.I. water costs
More real estate; narrower street widths
- More real estate; narrower street widths
Scribe Capabilities
Continuous Scribe: primarily used to separate ICs.
- Continuous Scribe: primarily used to separate ICs.
Skip Scribe: ideal for laser bar applications with a blocking feature.
- Skip Scribe: ideal for laser bar applications with a blocking feature.
Edge Scribe: used for wafer cleaving.
- Edge Scribe: used for wafer cleaving.
Up to 150mm: configured for material up to 150mm in diameter.
- Up to 150mm: configured for material up to 150mm in diameter.
Breaking Methods
»Non-Contact
- Non-Contact Breaking: used to break wafers with delicate topside features (>7:1 die aspect ratio).
Anvil Breaking: the conventional break method used for most scribe and break applications.
- Anvil Breaking: the conventional break method used for most scribe and break applications.
Break Only: used on materials already scribed by either a laser or saw scribe.
- Break Only: used on materials already scribed by either a laser or saw scribe.
For more detailed information on Dynatex, please visit the Dynatex website